发明名称 MARKING RESINNSEALED SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To increase the adhesive strength of ink and ensure high-speed marking by making the marking after O2 plasma etching pretreatment of seal resin surface. CONSTITUTION:In O2 plasma etching, excited O2 hits resin surface so that spattering occurs and at the same time a volatile compound such as CO2 is generated to activate resin surface. Since resin surface is improved in wetting characteristic, therefore, no shortage occurs to the adhesion of ink. After pretreatment, a number of markings are made at a time using ultraviolet ray-hardening ink for example and the resin surface is hardened. This construction ensures high speed marking.</p>
申请公布号 JPS5671958(A) 申请公布日期 1981.06.15
申请号 JP19790149733 申请日期 1979.11.19
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 SERA MICHITOSHI
分类号 H01L23/00;H01L23/28;H01L23/544 主分类号 H01L23/00
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