| 摘要 |
<p>PURPOSE:To give clearances between divided pellets by giving tension to an extension to an extensible tape with one end thereof fastened when a semiconductor wafer fastened to the tape and placed on a table with a cushion put therebetween is broken using a roller. CONSTITUTION:A recess is provided in the surface of a reciprocating table 8 and filled with a cushion 9 made of rubber for example. On the other hand, a semiconductor wafer 1 is connected to an extensible tape 2 larger than the wafer 1 so that the lateral and longitudinal grooves provided thereon may be kept exposed and the groove side of the wafer 1 is contacted with the cushion 9 with one end of the tape 2 fastened to a table 8. Thereafter, the wafer 1 is pelletized along the grooves with a roller contacted with the upper side of the tape 2 turned oppositely to the transfer direction of the table 8 while the tape 2 is heated using a heater placed on the upper part of the table 8. Thus, clearances are given between divided pellets without causing any damage.</p> |
