| 摘要 |
<p>A composition comprises 65 to 95 parts by weight of a polyamide having the recurring group <FORM:1015408/C3/1> where R1 is a C2-C16 alkylene radical and R2 is hydrogen, a C1-C2 alkyl radical or a halogen, said polyamide having a molecular weight of 1,000 to 35,000, and correspondingly 35 to 5 parts by weight of a polyepoxide having at least two epoxy groups per molecule. Specified polyamides are those derived from alkylene diamines having 2 to 16 carbon atoms e.g. hexamethylene, tetramethylene, decamethylene, undecamethylene, dodecamethylene, hexadecamethylene and ethylene diamine and isophthalic, 5-1-butyl isophthalic, 5-chloro-isophthalic, methyl isophthalic, propyl isophthalic, isopropyl isophthalic, hexyl isophthalic or 5-fluoro-isophthalic acid. Specified polyepoxides are the reaction products of polyhydric alcohols or phenols e.g. glycols, glycerol, trimethylol propane, bis-phenol-A and polyphenols with epihalohydrins. The two polymers may be blended together in a polyamide solvent e.g. dimethylacetamide or dimethyl formamide or the dry powders may be mixed together optionally in the presence of a solvent for the polyepoxide e.g. acetone, methyl ethyl ketone, toluene, trichlorethylene or perchloroethylene. The resins react on the application of heat.</p> |
