| 摘要 |
<p>PURPOSE:To prevent damages of a lead wire by a method wherein a conduction current lead wire is passed from the outside of a container into a pipe penetrating a container sealing a semiconductor substrate in it and an angle of an end part of a pipe inner wall within a container of a semiconductor system connecting to the substrate. CONSTITUTION:A pipe 10 is installed penetrating through a container 8 which seals in it a semiconductor element substrate 2 such as a thyristor for electric power etc. and a conductive lead 7 for the gate use is passed through this pipe 10. The shape of the end part of the inner wall of such a pipe 10 within a container is made to have a contact surface having a smooth angle less than a right angle along the whole circumference of the inner wall to continue to the outer wall. With this, a catch of the lead wire is eliminated and a damage of a lead wire is prevented from occurrence, thus, a slack of a lead wire being eliminated, too.</p> |
