| 摘要 |
A method is disclosed for attaching and securing power supply leads to electrical components including ceramic multi-layer capacitors. A tape-shaped transport carrier is continuously provided with power supply leads having a U-shaped portion projecting over the edge of the transport carrier. The U-shaped portion is bent up to form a loop and is then provided with bends. The U-shaped connection part is bent down approximately 90 DEG so that the front bends form an insertion aid for the insertion of the components between the supply leads. A solder operation then follows. |
