| 摘要 |
PURPOSE:To obtain a high-reliability semiconductor device by using glass fiber having moisture content of eight percent or less by weight for reinforcing fill of Si resin. CONSTITUTION:A BSG long fiber 300 section, a hardening accelerator, mold lubricant and pigment are added to an Si base polymer 100 section as a reinforcing fill for kneading. The BSG fiber is previously heated in dry N2 at about 250 deg.C to maintain moisture content at eight percent or less by weight. With a semiconductor device sealed by the resin material, fraction defective is kept low for a voltage application test at high temperatures and a high-reliability device will be obtained. High yield will also be recognized for a hot and cold cycling test, an airtightness test and a high temperature and high humidity standing test. However, fraction defective will increase if the content of the glass fiber exceeds 10wt%. |
