| 摘要 |
<p>1355408 Epoxy/polyimide resins RHONEPOULENC SA 23 June 1972 [24 June 1971] 29603/72 Headings C3R and C3B Heat-curable compositions are obtained by reacting (a) an epoxy resin with (b) an imide group containing prepolymer obtained by heating at 50‹ to 250‹ C. (i) a bis-imide wherein D is an unsaturated divalent organic radical and A is a C 2-30 divalent radical, with (ii) a polyamine of average formula wherein R is a C 1-8 divalent hydrocarbon radical derived from an aldehyde or ketone R = O and x is 0À1 to 2, in proportions such that (i) provides 1 to 50 imide groups per -NH 2 group from (ii). Numerous examples of reactants (a) and (b) are given and reference is made to Specification 1,355,403 in respect of (b). Reactant (b) may constitute 5 to 90 wt. per cent of (a)+(b) and may be prepared in situ in (a). Reaction of (a) with (b) may be effected at 50‹ to 200‹ C. to give a liquid or pasty product which may be cast directly, cooled and ground to give a moulding powder, or dissolved, e.g. to give a laminating solution. The composition may also contain up to 10% by weight of (b) of an aromatic compound containing 2 to 4 benzene rings which does not subline or boil below 250‹ C. Numerous such compounds wherein the rings are linked directly or via various linking groups are specified. Fibrous or pulverulent fillers may also be included. In examples (a) is various commercially available products, one having the average formula and another the average formula where m results in 0À556 epoxy group per 100 g.; (b) (i) is N,N<SP>1</SP>-4,4<SP>1</SP>-diphenylmethane bis-maleimide; and (b) (ii) is of the specified formula wherein R is CH 2 and n is 0À24 or 0À59. The curable composition is formed at 130‹ to 160‹ C. and the moulded at 250‹ C. Uses.-The compositions are stated to be particularly useful in applications requiring good mechanical and electrical properties and chemical inertness at 220‹ to 300‹ C., e.g. plate or tubular insulators for dry transformers, plates for transformer and motor armatures, in printed circuits, panels with honeycomb structure and compressor vanes. Reference is made to Specifications 1,280,846, 1,276,646, 1,260,819 and 1,190,718.</p> |
| 申请人 |
RHONE-POULENC S.A., 75000 PARIS, FR |
发明人 |
BALME, MAURICE, SAINTE-FOY-LES-LYON, FR;GATTUS, JEAN, LA MULATIERE, FR;GERARD, BERNARD, LYON, FR |
