| 摘要 |
PURPOSE:To prevent the deformation of lead chips in a handling process in transportation and the like by providing a suspending plate which is commonly connected to a plurality of the lead chips of a lead frame and separating the suspending plate immediately before the lead chips are fixed to a ceramic plate. CONSTITUTION:The lead frame 21 comprises a picture-frame shaped frame 211, a plurality of lead chips 212 which extend inward from the frame 211, and a suspending plate 213 which is located approximately at the center of the frame 211 and is connected to the inner ends of all the lead chips. Said lead frame 21 is punched out of belt shaped metal plate and formed by machining. Immediately before the lead frame is placed on a ceramic plate, the suspending plate 213 is separated from the lead chips 212. Then, the lead frame 21 is fixed to the periphery of the one surface of the ceramic plate. A semiconductor pellet is fixed to the recess at the central portion of the ceramic plate and connected by bonding wires. Then, the frame 211 is separated, a ceramic cap is placed, and the sealing is accomplished by low-melting- point glass. |
