| 摘要 |
<p>A nickel-copper series metal-bound diamond grinding material is provided. This sintered material comprises 2 to 30 wt.% of copper, 1 to 40 wt.% of tin, 0.2 to 3 wt.% of phosphorus, and balance (not less than 50 wt.%) of nickel retaining dispersed therein diamond and provides a metal-bound diamond grinding material which minimizes tooth-blocking and fluctuation in grinding amount. </p> |
