发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To obtain a high rupture resistance by interposing a synthetic resin cylinder which has an electrical insulation and a heat resistance, and is soft and elastic, at the peripheral part of a structure within the cylinder, when a semiconductor element structure held at its upper and lower parts between electrodes is accommodated in an insulating housing cylinder. CONSTITUTION:A pair of annular lids 2 and 2' are opposed to both end surfaces of an insulating housing 1 made of ceramics and the like, and fused together, and a semiconductor element structure 14 is accommodated in the housing 1, and both front and back surfaces of the structure 4 are held between electrodes 3 and 3' infiltrated in a through hole formed between the lids 2 and 2', thereby to form a semiconductor device. In this structure, between the inner periphery of the housing 1 and the outer periphery of the structure 14, there is inserted a cylindrical body 26 comprising a cylindrical part 26a such as silicone rubber, teflon or the like, having excellent electric insulation and heat resistance, and further elasticity, and a flange part 26b, and the peripheral edge of the structure 14 is pressed by the cylindrical part 26a. By said procedure, the rupture resistance of the device increases against an arc, and therefore said device is suitable for use in an apparatus requiring a large electric power.</p>
申请公布号 JPS5635439(A) 申请公布日期 1981.04.08
申请号 JP19790110349 申请日期 1979.08.31
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 ARAKI YOUICHI;NAKAJIMA KAZUYUKI
分类号 H01L23/04;H01L23/051 主分类号 H01L23/04
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