发明名称 TWOOLEVEL MOLD
摘要 PURPOSE:To form a two-level mold wherein the filling of each mold with resin is well balanced, by connecting a sprue to a divergent point toward the runner of each mold and thus equalizing the length of the route to each cavity. CONSTITUTION:A sprue 9 is connected to a divergent point 25 of the runner 6 of the 1st-level mold 2 from the runner 7 of the 2nd level mold 4. By using the above two-level mold, a mold plate 14 on the movable side is moved to a mold plate 13 on the fixed side, thus the 1st-level mold 2 being fitted to the 2nd-level mold 4. Next, thermosetting resin is injected through the sprue 9 and the divergent point 25 and filled up in the 1st- and 2nd-level cavities 1 and 3 through the intermediary of the 1st- and 2nd-level runners 6 and 7, respectively. Then, the mold plate 14 on the movable side being separated from the mold plate 13 on the fixed side, the metal molds 2 and 4 are separated from each other and then the 1st- and 2nd-level knockout plates 22 and 24 are driven, thereby molded articles 16 and 17 obtained being taken out.
申请公布号 JPS5634439(A) 申请公布日期 1981.04.06
申请号 JP19790112024 申请日期 1979.08.31
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TAJIMA YUKIO
分类号 H01L21/56;B29C41/00;B29C43/00;B29C45/00;B29C45/27;B29C45/32;B29C45/37;B29C45/38;B29C45/40;B29C45/73 主分类号 H01L21/56
代理机构 代理人
主权项
地址
您可能感兴趣的专利