| 摘要 |
<p>A method for detection of unacceptable solder joints (6), especially solder pads (9, 10) on printed circuit boards (PCBs) (1), by means of the application of acoustic vibrations over a range of frequencies to the solder joint (6) and observation of the acoustic impedance of the joint (6) as reflected back through the driver (7) to the acoustic generator or through an acoustic detector (8) near the generator to electrical detecting means. </p> |
