Highly integrated semiconductor device - has housing with fine connecting wires and thicker conductors for both operating and testing contacts

摘要

The highly integrated semiconductor device has a housing (3) with a recess near the middle, containing the semiconductor slice (7). A set of fine connecting wires (6) extends inside the recess towards thicker wires (1) for connection to contacts (2) along the sides, at one end. Further thicker wires (5) connect a proportion of the fine wires with contacts (4) so that test readings can be made. The housing has a top cover, and the test contacts are embedded in holes through this cover. These contacts are arranged in a pattern so that a circuit testing device with a set of test pins can be brought into contact with the device, to make a number of tests simultaneously.