| 摘要 |
PURPOSE:To secure the positional accuracy of a ceramic case with a lead frame by placing a semiconductor element on the lead frame itself to shorten the time of heating required for placing it, and bonding a wire to the frame itself. CONSTITUTION:After solder 4 is attached to a lead frame 8, a semiconductor 5 is placed thereon while heating it, and the element 5 is connected to the lead 2 with a wire 6. Then, it is sealed with ceramic cases 1, 7, and is separated respectively. This configuration can save heating energy to heat to the temperature required to solder it, improve element placing accuracy and linear bonding property and secure the positional accuracy of the frame to the ceramic cases. |
