| 摘要 |
<p>PURPOSE:To reduce the size of a metallized pattern of a lead mounting part for miniaturizing the title capacitor device and improving the electrical characteristics by tapering the opposite surface to a brazed surface of an electrode lead wire for thinning the same. CONSTITUTION:The title capacitor device includes a semiconductor vessel comprising an insulating substrate 1 composed of a semiconductor device mounting part 2-2 having a metallized pattern selectively provided on the surface of the device and of lead mounting parts 2-1, 2-2, further comprising electrode 3-1, 3-2 braded to the lead mounting parts 2-1, 2-2. The electrode leads 3-1, 3-2 are thinned toward their tip ends. Namely, they are tapered, and the angle of the tapered part is set in place in conformity with the shape of a wedge 7. Hereby, the size of the metallized pattern of the lead mounting parts 2-2, 2-2 can be reduced, thereby miniaturizing the device and hence reducing the parasitic capacitance.</p> |
