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发明名称
Vorrichtung zum Kuehlen von Leiterplatten nach dem maschinellen Einloeten von elektrischen Bauteilen
摘要
申请公布号
DE2932398(B1)
申请公布日期
1981.02.19
申请号
DE19792932398
申请日期
1979.08.09
申请人
SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN
发明人
BAHNSEN, HEINER, 8900 AUGSBURG;RUMPF, DIETRICH, DIPL.-PHYS., 8000 MUENCHEN
分类号
B23K3/08;H05K3/34;(IPC1-7):H05K3/34
主分类号
B23K3/08
代理机构
代理人
主权项
地址
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