| 摘要 |
PURPOSE:To make easy and sure the lead wire connection to the terminals made after, by preventing the oxidation of the terminal part, through heat treatment, removal of protective film, and exposure of terminal connecting metal film, after the provision of heat treatment protective film to the part of terminal connection. CONSTITUTION:The closely adhered layer 9 consisting of chromium, etc. and the metal layer 10 having the material suitable for soldering (e.g., Ni-Fe) are formed on the conductor part 3' from the conductive layer placed on the substrate 1. Next, on it, the protective film 11 for plasma etching using gold, and the protective film 12 for heat treatment using silicon oxide are formed. Further, heat treatment is made and finishing process specified is made, then the protective film 12 is removed with plasma etching to expose the protective film 11 formed with gold and the soldering connection of the lead wire to the terminal is made. |
