发明名称 |
PRODUCTION OF SEMICONDUCTOR LASER |
摘要 |
<p>PURPOSE:To obtain chips of a uniform size with high accuracy by forming V grooves parallel to resonator end face forming direction on the back of a semiconductor substrate and cleaving the substrate along the grooves.</p> |
申请公布号 |
JPS5362489(A) |
申请公布日期 |
1978.06.03 |
申请号 |
JP19760138210 |
申请日期 |
1976.11.16 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
OOMURA ETSUJI;IKEDA KENJI;SUZAKI WATARU |
分类号 |
H01L33/30;H01S5/00;H01S5/042 |
主分类号 |
H01L33/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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