发明名称 PRODUCTION OF SEMICONDUCTOR LASER
摘要 <p>PURPOSE:To obtain chips of a uniform size with high accuracy by forming V grooves parallel to resonator end face forming direction on the back of a semiconductor substrate and cleaving the substrate along the grooves.</p>
申请公布号 JPS5362489(A) 申请公布日期 1978.06.03
申请号 JP19760138210 申请日期 1976.11.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 OOMURA ETSUJI;IKEDA KENJI;SUZAKI WATARU
分类号 H01L33/30;H01S5/00;H01S5/042 主分类号 H01L33/30
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