| 摘要 |
<p>The semiconductor module exhibits a series circuit of two semiconductor components (3, 4, 5; 13, 4, 6) mounted electrically insulated and thermally conductively on a metallic baseplate (1). It also exhibits three series-connected current-conducting terminals (7, 9), one of which (9) is allocated to the connecting conductor between the semiconductor components and is at one end of the series and the two other ones of which (7) are in each case mounted together with a semiconductor component on a common contact part and via an intermediate disk (2) of insulating material on the baseplate (1). The housing consists of the baseplate (1) and a plastic part (12). The baseplate (1) is constructed to be cup-shaped and is provided at its inner bottom surface with raised or depressed parts for holding the disk (2) of insulating material and the contact components. Furthermore, the edge zone (12a) of the plastic part (12) is constructed to be suitable for producing an edged connection with the baseplate (1) and is permanently connected to the side wall (1a) of the baseplate by edging, and for the baseplate, a material is selected which provides for a solid connection with components of copper or of light metal. This ensures correct mutual connection of the parts and good dissipation of the heat loss to a cooling component. <IMAGE></p> |
