| 摘要 |
PURPOSE:To automatically discriminate whether the condition of titled bonding is good or not during bonding by storing the shape of the oscillation output waveforms at the wire bonding into a memory and comparing the waveform thereof with the waveform having beforehand been inputted. CONSTITUTION:A transducer 2 is machanically vibrated by the constant voltage output from an ultrasonic wave oscillating electric source 1 and a tool 4 is vibrated via a horn 3, by which a wire 5 is bonded to the sample in the state that it is held pressed thereto. The current waveform of this time is shaped by a waveform shaping circuit 8, and the thus obtained current shaped waveform is inputted via an AD converter 9 and a DMA control unit 10 to the memory 12 of a microcomputer 11. On the other hand, an ideal waveform is beforehand inputted to the computer 11 and whether the bonding condition is good or not is discriminated by checking the current waveform having been stored in the memory 12 with the computer 11. In addition, the computer 11 emits a command to a bonding device control section 13 at a proper time so that the oscillation of the electric power source 1 is stopped. |
