| 摘要 |
A method is disclosed for the temporary retention of insulated electrical leads by a printed circuit board preparatory to permanent electrical and mechanical attachment. Also disclosed is apparatus for forming the leads for said retention. The lead has a metallic wire therethrough with a residuum of elasticity. The printed circuit board consists of an insulative sheet with a plurality of selectively interconnected metallic electrical terminals each having a hole therethrough smaller in diameter than the outside diameter of the electrical lead, but larger in diameter than the wire by a factor of appreciably greater than 2. The method according to the invention comprises stripping the insulation from an end of the lead to provide a predetermined length of wire projecting from the abutment of the insulation formed by the stripping. The wire is then folded to form a narrow J-hook, the folded width of which is appreciably greater than the diameter of the hole. The point of the fold is selected such that the distance between the tip of the wire and the abutment of the insulation is substantially equal to the thickness of the board. The tip of the wire is offset to form a spur. When the retentive configuration is inserted into the hole, the J-hook is constricted to provide entry into the hole and thereafter, because of its residuum or elasticity, expands. The abutment of the insulation limits the distance of entry of the wire into the hole, and the spur, together with the expansion of the J-hook, inhibits withdrawal of the lead from the hole.
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