| 摘要 |
A planar semiconductor device having a cathode region surrounding an anode region is flip chip mounted to a conductor film circuit. An anode contact extends from the anode region and is bonded to a first portion of the conductor film circuit such that that portion of the cathode region which overlaps the first portion of the conductor film circuit is minimized. That portion of the cathode region distal from the anode region is relatively wide, and a relatively large area cathode contact extends from the cathode region and is bonded to a second portion of the conductor film circuit.
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