Positive-acting photoresist composition

摘要

A positive-acting light-sensitive composition having excellent utility as a photoresist, comprising: (a) a crosslinked urethane resin formed by a catalyzed crosslinking of a non-heat reactive novalac phenolic resin and a polyisocyanate compound; (b) an epoxy resin having an epoxide equivalent weight of less than about 400 and a curing agent therefor; and (c) a positive-acting photosensitizer. Upon applying to a substrate and drying, the epoxy resin cures, resulting in a film useful as a photoresist or in the formation of lithographic printing plates.