| 摘要 |
PURPOSE:To reduce electric resistance as well as lighten the weight of grid by a procedure in which thin plates of lead, etc., is closely adhere to both sides of a synthetic resin grid and pressed by means of a given mold to attach the contact portions of the thin plates to each other by resistance welding. CONSTITUTION:The synthetic resin grid 1 separately formed is put between the thin plates 2 of lead or a lead alloy, having a slightly larger dimension than the grid 1, in such a way that the meshes of the thin plates 2 are situated at the centers of the meshes of the synthetic resin grid 1. Then, the thin plates 2 are pressed from both sides by means of the mold 3 with the groove 4 large enough to receive the synthetic resin grid 1 and also the electrode 5 and then the contact portions where the thin plates 2 completely embrace the grid 1 are welded by a resistance welding method by flowing a high current through the electrodes 5 for a short time. |
