| 摘要 |
<p>PURPOSE: A stack type package is provided to prevent quality defect due to heat generated when an upper single package and a lower single package are electrically connected to each other by connecting the packages using a connecting wires. CONSTITUTION: A BLP type upper single package(20) and an SOP type lower single package(30) are vertically disposed, and the upper/lower packages(20,30) are electrically connected by a connecting wire(40). In the upper single package(20), a plurality of leads(22) are attached to bottom both sides of a semiconductor chip(21), the leads(22) are respectively wired by metal wires(23). The chip(21), metal wires(23) and leads(22) are molded by encapsulant(24). In the ower single package(30), inner leads(33a) are attached to top both sides of a chip(31) through bumps(32). The inner leads(33a), the chip(31) and bumps are molded by encapsulant(34).</p> |
