| 摘要 |
PURPOSE:To improve the etching accuracy by horizontally shaking the semiconductor wafer in the etching liquid and performing a step etching of both sides of the main surface alternately with the surface upside down. CONSTITUTION:The cassette jig b is placed in the etching tank f having the etching liquid h and the cooling water i therein in such a manner that the wafer is kept horizontal. The wafer is shaked slowly turning the jig b. The wafer is turned upside down each time the step etching is made and then etched. This can slow down the reduction speed of the etching liquid to make the etching even thereby minimizing the irregularity in the etching. |
