| 摘要 |
PURPOSE:To enable the high-reliability package assembly by providing a wire bonding device with a tub-down molding mechanism. CONSTITUTION:The operations before a wire bonding step are effected under the condition that a tub 4b and an inner lead 4c are flat, thereby enabling the close contact of a heater plane and a back side of the tub during a so-called curing step for curing a bonding member 34 of a pellet 18 and accordingly increasing a heating efficiency. A lead frame supplied from a loader mechanism 6 is transported along a chute 10 and is stopped in the position of a tub-down molding mechanism 12 and a bending punch 16 comes down from the above to press the part of a tub hanging lead 4a of the lead frame 4 and to effect tub lowering. The lead frame 4 is further transported along the chute 10 and stops in the position of a bonding mechanism 14, where wire bonding is effected. |
