| 摘要 |
PURPOSE:To eliminate the influence of stress created at the time of resin seal upon a semiconductor device by a method wherein foaming material is applied around the assembled semiconductor device beforehand and the device is sealed with resin at the temperature below the melting point of the foamed material. CONSTITUTION:Synthetic resin foaming material 5 is applied around an assembled semiconductor chip 1 and a die pad. By heating, the synthetic resin foaming material 5 is foamed and expanded to the volume of 40-50 times of its initial volume and securely surrounds and covers the respective assembled parts with its expanded independent foams. After the respective parts covered with synthetic resin foaming material 5 like this are placed in a molding die heated to approximately 160 deg.C, the parts are molded with thermosetting synthetic resin 7 at the temperature below the melting point of the synthetic resin foaming material 5 by transfer molding and the whole assembly is molded in the same way. Then, after the sealing resin 7 is cured, the respective resin sealed parts are taken out of the molding die and the whole assembly is independently heated at the temperature above the melting point of the synthetic resin foaming material 5.
|
