ELECTROLESS COPPER PLATING

摘要

For: ELECTROLESS COPPER PLATING.- Maintaining copper ion concentration and controlling the increasing concentration of salt-forming anions in electroless copper plating of articles by contacting all or a portion of the copper deposition solution after interruption of plating in an enriching operation to replenish its depleted copper content by using a selected copper-containing substance (e.g., cupric oxide or basic copper sulfate) having either a small or no content of salt-forming anions to minimize the undesirable build-up of salts, and resuming plating with the enriched solution or portion thereof.