发明名称 SEMICONDUCTOR DEVICE SEALED UP WITH RESIN
摘要 PURPOSE:To avoid strain concentration to the jointed part of a lead and prevent it from becoming defective, by protruding the lower part of the lead fitting portion of a resin package along the bending shape of the lead. CONSTITUTION:A projection 8 is made under the lead fitting portion of a resin package 1. A lead is bent along the projection 8. When the lead is thrusted by an upper mold, stress does not concentrate to the jointed part of the lead because of the projection. At that time, the lead is bent along the corner of the projection. It is effective to slightly round the corner of the projection at R. This results in preventing the cracking of the resin package, the breake of a pin, the cracking of the lead, etc.
申请公布号 JPS564255(A) 申请公布日期 1981.01.17
申请号 JP19790079194 申请日期 1979.06.25
申请人 发明人
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址