| 摘要 |
<p>.- Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvents(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.</p> |
