| 摘要 |
PURPOSE:To save the quantity of used gold by a method wherein when the wire bonding part of the conduction pattern and the diamond touch part, which are fitted in the concave of the ceramic substrate, are plated with gold, the thickness of gold film is thinned on the touch part. CONSTITUTION:The concave is formed in the central part of the ceramic substrate 1 that is to be a package, and the ceramic substrate 1c that has the diamond touch part 2 for securing the semiconductor chip, ceramic substrate 1b that has the conduction pattern 3' and ceramic substrate 1a wherein a window is opened are laminated from the lower side in turn and fitted in the concave. In this way, current is fed to the wire bonding part 3 of the conduction pattern 3' and touch part 2 by means of the lead frame 4 of the substrate 1 in order to form the gold plated layer. At this time, the touch part 2 is connected to the opposite pattern R to control the current that flows in the touch part 2, and only the gold film for securing the semiconductor chip is made thinner. |
