| 摘要 |
PURPOSE: To obtain a resin composition which does not form burrs when used to seal a semiconductor element. CONSTITUTION: This composition is an epoxy resin composition filled with an inorganic filler having a Wadell's sphericity of 0.7-1.0 and predominantly consisting of particles with a diameter of 50μm or below. These particles have such a particle diameter distribution that the content of particles with a diameter of 5μm or below is 5.0-20.0wt.%, that of particles with a diameter of 6-10μm is 5.0-15.0wt.%, and that of particles with a diameter of 11-50μm is 60.0-80.0wt.%.
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