| 摘要 |
A system for bonding pellets, for example semiconductor chips (1, 1n) to supports, for example lead frames (6), has a pellet supply stage (I), a bonding stage (II) and an intermediate stage (III). Pellets (1, 1n) are transferred from the supply stage (I) onto a table (3) of the intermediate stage (II). The position of the table (3) in the X-Y directions and the angular position of the X-Y plane are controlled by control means (13) to bring a pellet (1, 1n) on the table to a desired position for transfer to the bonding stage (III) for bonding to a support (6). <IMAGE> |
