| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce size and cost and enhance the strength of connection by bonding a semiconductor chip to an area in a frame where the chip is to be placed, connecting connecting pieces with the semiconductor chip through a metal thin wire, sealing the workpiece with resin so that the connecting pieces are exposed, removing coupling bodies, and individually separating the connecting pieces. SOLUTION: A frame 10 has an island 11 to bond a semiconductor chip to be formed in the center, and a coupling body R extending from each corner through suspending leads 12 is formed so that the island 11 is encircled with the coupling bodies R. First connecting pieces 13 extending toward the island 11 are integrally formed on the coupling bodies R at substantially equal intervals, and second connecting pieces 14 extending outward from the coupling bodies R are formed. The connecting pieces 13 and 14 are separated by removing the coupling bodies R. Thus, the overall size and cost of the semiconductor device are reduced and the strength of connection with a mounting board is enhanced.</p> |
