| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor having a reliable thin film membrane structure. SOLUTION: A sensor chip 3 (silicon substrate 10) is bonded on a stem 1. In the silicon substrate 10, a through hole 11 is formed, opening on the upper and lower surfaces of the substrate 10. In an opening in the upper surface of the substrate 10, a sensor element Es of a thin film membrane structure is formed. An adhesive layer 2 disposed between the silicon substrate 10 and the stem 1 has a region not applied with an adhesive which connects the inside R1 and outside R2 of the through hole 11 formed in the substrate 10, resulting in the formation of a communication path 21 which allows the inside R1 and outside R2 of the through hole 11 to communicate with each other, in a joint part between the stem 1 and the substrate 10.
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