| 摘要 |
PURPOSE:To shut off an X-ray irradiated from other electric apparatus and to prevent the variation and decrease of the characteristics and life of a resin sealed semiconductor device by sealing the device with thermosetting resin mixture mixed with lead powder treated in surface insulation or mere lead powder. CONSTITUTION:The semiconductor element 5 is secured to a metallic support 4a, and wire bonded to other metallic supports 4b, 4c in an assembly. This is sealed with thermosetting resin mixture. This mixture contains epoxy resin, polyester resin, silicone resin as thermosetting resin 1 with metallic oxide powder 2 such as alumina, silica, magnesia and lead powder 3, together with mold releasing agent, accelerator and pigment and the like. The surface of the lead powder particles are oxidized with oxidizer to surface insulation treat it. In this manner, the lead powder is uniformly dispersed to prevent the X-ray from passing through the electric apparatus such as television and enhance the life and the variation in the characteristics of the element. |
