| 摘要 |
<p>A metallic substrate and an outer thermoplastic resinous coating are bonded to one another by a resinous polyamide hot melt adhesive prepared by condensation of an unpolymerized amide-forming dicarboxylic- containing compound or polymeric fatty acid with a diamine of the formula: wherein each of R4, R5, R6 and R7 is a hydrogen atom or an alkyl radical; X is a nitrogen atom or a carbon atom bearing a single hydrogen substituent and n is an integer of from 1 to 6 inclusive. The adhesive is first applied to the metal substrate with sequential deposition of the thermoplastic resinous outer coating.</p> |
