| 摘要 |
An electronic chip formed of at least one second elementary chip set in first elementary chip so that the surfaces of the elementary chips are substantially in the same plane wherein the first elementary chip is formed of a heterogeneous substrate including a surface layer above a layer of different doping and defining at least one cavity extending the entire thickness of the second layer and at least one metal interconnection level connecting the at least one second elementary chip to the first elementary chip.
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