| 摘要 |
PURPOSE:To connect a small area pad for soldering a semiconductor device formed on the one main surface opposed with the side surface of an inverted leadless package through a cutout groove to a large area measuring pad formed on the other main surface thereof and easily measure for testing. CONSTITUTION:A semiconductor element 1 is secured to the interior of a ceramic substrate 1, and connected through a connecting wire 3 to a bonding pad 4. A conductive layer 6 for connecting the pad 4 to the soldering pad 7 is led, and connected through the surface of a cutout groove 8 for measuring the substrate 1 to the main surface formed on the pad 7 and to the pad 9 for measuring on the other main surface. According to this configuration, since large area measuring pad can be employed, it can alleviate the problem of the displacement of the position of the measuring probe to easily conduct a testing. |
