| 摘要 |
<p>Chipboard cake is coated with bonding in two stages in the first of which the upper face of the cake is coated and after turning of the cake the lower face is coated in the second stage. Uniform coating of the particles on opposite faces of the cake is warranted. Pref. the coarser chip fraction consisting of laminar particles is oriented in a thin layer before the first stage and the turning is effected after each stage. Several stages may be used to make up the chipboard cake cross-section of the desired particle size distribution, with the finer particles being disposed in the central portion of the cake.</p> |
