METHOD FOR CLEANING APPARATUS FOR FORMING A LAYER

摘要

A method for cleaning a film formation apparatus is provided to suppress formation of suspended solid on a lower portion of a process chamber by decreasing a temperature difference between upper and lower portions of the process chamber. An upper portion of a process chamber in which an attachment generated when a film is formed is adhered is heated(S210), and a rinsing gas for removing the attachment is introduced into the process chamber(S220). A diluent gas for diluting the rinsing gas is supplied into the heated upper portion of the process chamber to decrease a temperature difference between the upper portion of the process chamber and a lower portion of the process chamber. The rinsing gas is F2 or ClF3, and the diluent gas is N2, Ar or He.