发明名称 DEVICE FOR TRANSFERRING THIN PLATE
摘要 PURPOSE:To smoothly transfer a semiconductor wafer by composing a semiconductor wafer holder of two symmetrical holders at accommodating and receiving sides, facing the holder accommodating the wafer and a vacant holder oppositely and pushing it with a transfer tool to move horizontally the wafer. CONSTITUTION:Wafer holders 1 at accommodating and receiving sides are composed of both side plates 3a, 3b having a plurality of grooves 4a, 4b for standing the wafers 2 in space on the inner surfaces thereof and stationary bars 5 for fixing the plates 3a, 3b. Two holders 1 are thus formed in substantially the same shape. The projections 6 and the recesses 7 formed on the upper end surfaces Fa1 of the plates 3a and 3b are symmetrically formed to engage the two holders with each other when making contact with the holders. Then, the holder accommodating the wafer 2 and the vacant holder are plated on a stand 8 while engaging them each other, a transfer bar 11 having a slide 12 is pressed into the holding base at accommodating side to smoothly horizontally move the wafers 2 in the two holding bases.
申请公布号 JPS55143026(A) 申请公布日期 1980.11.08
申请号 JP19790051285 申请日期 1979.04.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 SUEHIRO KAZUTO;NISHIHATA MIKIO
分类号 B65G1/07;B65G1/00;H01L21/02;H01L21/677 主分类号 B65G1/07
代理机构 代理人
主权项
地址