METHOD OF PACKAGING SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent occurrence of improper package of a semiconductor device by bonding the flat portion between a package base and a frame with glass, bending the lead wire by utilizing the adhering strength and an auxiliary pressing force by a jig and attaching a cover thereon. CONSTITUTION:A flat frame 3 is mounted on a package base 2 secured with a semiconductor pellet 1 thereto and connected to a wire 4. A lead wire 5 is secured via a jig 6 by utilizing the adhering strength of the frame 3 to the base 2 and bent in predetermined shape. According to this method, the package base 2 can be effectively isolated from the frame 3. A cover 3 is finally coated thereon.