| 摘要 |
<p>PURPOSE:To make manufacturing process of a hybrid integrated circuit simple by a method wherein both side electrodes of a laminated ceramic capacitor make contacts with U-shaped part of an H-type terminal and after cutting U-shaped part measurement is made and an optimal capacitor is selected and afterwards it is fixed. CONSTITUTION:A hybrid IC substrate is placed on a hot plate 9 controlled at specified temperature, and for adjustment of capacitance a laminated ceramic capacitor 10 for adjustment is mounted at both sides of U-shaped part 6 of the H-type terminal 5 contacted with its Ag electrodes, and the central part of U-shaped part 6 being cut at 11, electric characteristic is measured. Through repetition of these processes a capacitor 10 which has optimal capacitance is selected, and it is fixed by soldering. By this method reliability of connection is improved and manufacturing process is simplified because of less effect due to heat for soldering upon a metal foil 8 on the substrate.</p> |
