Method of encapsulating a molded ceramic member

摘要

For the encapsulation of a molded ceramic member for high-temperature isostatic pressing, the molded member, which preferably is of silicon ceramic, is covered with a dense surface coating of an Si melt. Thereafter, the coating is exposed to an N2 atmosphere at a temperature of within about 800 DEG to 1400 DEG C. for so long until the Si coating is converted into a Si3N4 coating.