Housing for semiconductor device

摘要

Housing for a semiconductor device includes a housing cup in which the semiconductor device is disposed, the housing cup has a bottom, at least one wall and a metal plate disposed opposite the bottom. The metal plate is thermally connected to the semiconductor device and has a mounting surface connectible to a heat sink and a lateral surface perpendicular to the mounting surface. Contacts extend from inside the housing cup through the bottom and are firmly connected thereto. Cutouts are formed in the metal plate at the edges thereof opposite said contacts. The mounting surface of the metal plate extends beyond the wall opposite the bottom. The housing is fillable with sealing compound through the cutouts to an extent where at least part of the lateral surface of the metal plate is wetted with sealing compound.