发明名称 |
Method of bonding substrates made of metal or alloy |
摘要 |
Substrates made of a metal or an alloy are bonded by coating a brazing flux incorporating a metallic powder or a metal compound powder on the surface of the substrate having a melting point of higher than 700 DEG C.; and heating them at a temperature higher than a melting point of the flux but lower than a melting point of the metal of the metallic powder or the metal compound powder whereby a molten crystallization and a mutual diffusion are caused between the substrates and the metal activated by the molten flux.
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申请公布号 |
US4228944(A) |
申请公布日期 |
1980.10.21 |
申请号 |
US19780954284 |
申请日期 |
1978.10.24 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
INAMURA, MINORU;TAKEUCHI, NOBORU;INUKAI, KAZUHIRO;TANINOUCHI, KENTARO;UTSUNOMIYA, SHIN |
分类号 |
B23K1/00;B22F7/06;B23K1/19;B23K35/00;B23K35/34;(IPC1-7):B23K1/04;B23K25/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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