发明名称 Method of bonding substrates made of metal or alloy
摘要 Substrates made of a metal or an alloy are bonded by coating a brazing flux incorporating a metallic powder or a metal compound powder on the surface of the substrate having a melting point of higher than 700 DEG C.; and heating them at a temperature higher than a melting point of the flux but lower than a melting point of the metal of the metallic powder or the metal compound powder whereby a molten crystallization and a mutual diffusion are caused between the substrates and the metal activated by the molten flux.
申请公布号 US4228944(A) 申请公布日期 1980.10.21
申请号 US19780954284 申请日期 1978.10.24
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 INAMURA, MINORU;TAKEUCHI, NOBORU;INUKAI, KAZUHIRO;TANINOUCHI, KENTARO;UTSUNOMIYA, SHIN
分类号 B23K1/00;B22F7/06;B23K1/19;B23K35/00;B23K35/34;(IPC1-7):B23K1/04;B23K25/00 主分类号 B23K1/00
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