SPUTTERING APPARATUS AND METHOD FOR MANUFACTURING THIN FILM

摘要

PROBLEM TO BE SOLVED: To provide a technique capable of forming a thin film having a low contact resistance by a cylindrical sputtering target.SOLUTION: When arranging a cylindrical sputtering target 21 inside a vacuum chamber 11 and reaching sputtering particles to a moving object 2 to be deposited to form a thin film, emission direction particles emitted from first and second places having zero of a magnetic force component in the emission direction out of the outer peripheral surface of the sputtering target 21 is moved from an upstream place and is emitted toward a portion of the object 2 to be deposited moving a downstream place after meeting the sputtering target 21. An initial thin film is formed by sputtering particles without including the emission direction particles.SELECTED DRAWING: Figure 5