Microwave arrangement for the transmission of high-frequency signals

摘要

The invention relates to a microwave arrangement for the transmission of high-frequency signals of high powers comprising a microstrip conductor on an upper side of a substrate. The microstrip line comprises a multi-stage signal splitter and a ground surface on an underside of the substrate disposed opposite to the upper side. A defected ground structure is introduced into the ground-surface below a first stage of the signal splitter. Further a power combiner and/or a power splitter with a microwave arrangement according to example embodiments of the invention.

主权项

1. An apparatus comprising:
a microstrip conductor on a first upper side of a substrate, wherein the microstrip conductor comprises a multi-stage signal splitter; and a ground surface on a lower side of the substrate disposed opposite to the first upper side, wherein the ground surface includes a defected ground structure disposed below a first stage of the signal splitter, wherein a width of the microstrip conductor is configured to achieve a preferred complex line wave-resistance of the microstrip conductor at the first stage of the signal splitter.